The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 25, 1991
Filed:
Sep. 13, 1989
Applicant:
Inventors:
Nobuo Owada, Ohme, JP;
Kaoru Oogaya, Ohme, JP;
Tohru Kobayashi, Iruma, JP;
Mikinori Kawaji, Hino, JP;
Assignee:
Hitachi, Ltd., Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ;
U.S. Cl.
CPC ...
357 68 ; 357 65 ;
Abstract
A multi-layered structure of wirings on a semiconductor substrate has been employed in conjuction with the increase in the integration density of semiconductor integrated circuit devices. In the invention, dummy patterns made of the same material as an Al wiring layer for compensating for any step or level gradation are disposed in the regions below bump electrodes and in the proximity thereof in order to reduce any defects inherent to a multi-layered structure that occur in CCB bump electrodes formed on the multi-layered wirings and at pads as the base layer of the former.