The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 04, 1991
Filed:
Apr. 06, 1990
Applicant:
Inventor:
Nobuyoshi Ogino, Musashino, JP;
Assignee:
Shin-Etsu Handotai Co., Ltd., Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ; H01R / ; H01R / ;
U.S. Cl.
CPC ...
357 55 ; 437225 ; 437249 ; 148D / ;
Abstract
A semiconductor silicon wafer usable for integrated circuits has beveled portions unsymmetrically formed along circumferential edges of front and back surfaces thereof. An angle between an inclining surface of the beveled portion and a main surface on the back surface side is larger than that between the inclining surface of the beveled portion and the main surface on the front surface side. Therefore the circumferential edges are prevented from being chipped.
Ogino, Nobuyoshi. (1991). Beveled semiconductor silicon wafer and manufacturing method thereof (U.S. Patent No. 5021862). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/5021862
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile