The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 28, 1991
Filed:
Jun. 30, 1989
Hiroshi Oka, Yokkaichi, JP;
Chozo Okuda, Yokkaichi, JP;
Yoshinori Yoshida, Yokkaichi, JP;
Toshihiko Takahashi, Yokkaichi, JP;
Yoichi Kamoshida, Yokohama, JP;
Takao Miura, Yokkaichi, JP;
Japan Synthetic Rubber Co., Ltd., Tokyo, JP;
Abstract
A positive type radiation-sensitive resin composition comprising an alkali-soluble novolac resin and a 1,2-quinonediazide compound, characterized in that said alkali-soluble novolac resin is a resin produced by condensing a carbonyl compound and a phenol mixture comprising 6 to 94 mole % of m-cresol and 94 to 6 mole % of at least one compound represented by the formula (I) other than m-cresol: ##STR1## wherein X is --CH.sub.3, --C.sub.2 H.sub.5, --C(CH.sub.3).sub.3, --CO.sub.2 CH.sub.3 or --CO.sub.2 C.sub.2 H.sub.5 ; n is an integer satisfying 3.gtoreq.m.gtoreq.1; and m is an integer satisfying 3.gtoreq.m.gtoreq.1, in which resin when the polystyrene-reduced molecular weight is determined by a gel permeation chromatography using a monodisperse polystyrene as the standard, maximum values a, b and c present, respectively, in the molecular weight ranges of 6,300 to 25,000, 2,500 to 6,000 and 150 to 900 in the molecular weight distribution curve obtained satisfy the following relationships: a/b=0-1.5 and c/b=1.4-2. Said positive type-radiation-sensitive resin composition is excellent in resolution, sensitivity, developability, thermal resistance and adhesion and hence is useful as a positive type resist for producing integrated circuits having a higher integration.