The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 30, 1991
Filed:
Jun. 19, 1990
Applicant:
Inventor:
Hisaharu Obinata, Hatano, JP;
Assignee:
Nihon Shinku Gijutsu Kabushiki Kaisha, Kanagawa, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ;
U.S. Cl.
CPC ...
437203 ; 437 67 ; 437 78 ; 437 79 ;
Abstract
A thin film forming method for a substrate having one or more recesses using a vacuum deposition wherein the thin film to be formed on the substrate is heated and melted, and the melted material of the thin film is pressurized and forced into each recess so as not to have any void in the thin film.
Quick Actions:
Obinata, Hisaharu. (1991). Vacuum deposition using pressurized reflow process (U.S. Patent No. 5011793). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/5011793
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile