The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 26, 1991
Filed:
Jul. 09, 1990
Don L Baker, Johnson City, NY (US);
Joseph Funari, Vestal, NY (US);
William F Otto, Rochester, MN (US);
Bahgat G Sammakia, Johnson City, NY (US);
Randall J Stutzman, Vestal, NY (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
An electronic package which includes at least two flexible circuitized substrates (e.g., thin film elements) connected at one location to a common first circuitized substrate (e.g., printed circuit board) and at another location to a semiconductor device, these subassemblies being located within a base member of the package. In one embodiment, a singular heat sink member is thermally coupled to a respective one of the semiconductor devices, and a common, second heat sink member is thermally coupled to all of the first heat sink members. This common heat sink member also uniquely serves as a stiffener for the package. In another embodiment, a common heat sink member is securedly positioned on the opposite side of a first circuitized substrate from the plurality of flexible circuitized substrates and semiconductor devices. A base member is also used as part of this package. As in the aforementioned other embodiment, the common heat sink member also serves as a stiffener.