The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 05, 1991
Filed:
Dec. 18, 1987
Niraj Kumar, Milpitas, CA (US);
Steven R Boyle, Santa Clara, CA (US);
Zilog, Inc., Campbell, CA (US);
Abstract
A technique is disclosed for manufacturing an integrated circuit die which is capable of being packaged in any of two or more different package types having different arrangements of bonding posts. The circuit is laid out with redundant pads located at different places on the die so that one pad in each pair of redundant pads is accessible for bonding with posts in one package type, while the other pad in each pair of redundant pads is accessible for bonding with posts in another package type. Illustrative layouts are shown whereby various types of pads, e.g., power pads, signal input pads, signal output pads and bidirectional I/O pads, may be made redundant.