The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 29, 1991
Filed:
Nov. 03, 1989
Applicant:
Inventors:
Hiroshi Yamamoto, Neyagawa, JP;
Tsutomu Fujita, Hirakata, JP;
Takao Kakiuchi, Takarazuka, JP;
Kousaku Yano, Osaka, JP;
Shuichi Tanimura, Hirakata, JP;
Shinji Fujii, Hirakata, JP;
Assignee:
Matsushita Electric Industrial Co., Ltd., Osaka, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C23C / ; H01L / ;
U.S. Cl.
CPC ...
20419217 ; 437192 ; 437194 ; 437241 ;
Abstract
Disclosed is a method for fabricating an interconnection structure comprising a step of depositing an Al or Al alloy film on a dielectric film by a sputtering method improved in step coverage, a step of processing said Al or Al alloy film or a layered metal film thereof with another metal film into a metal line, and a step of depositing a film of high melting point metal or alloy thereof on the top and side surfaces of said line.