The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 08, 1991
Filed:
Mar. 18, 1988
Applicant:
Inventors:
Hiroshi Gokan, Tokyo, JP;
Masahito Mukainaru, Tokyo, JP;
Masayoshi Suzuki, Tokyo, JP;
Hisanao Tsuge, Tokyo, JP;
Hidehiko Matsuya, Kyoto, JP;
Assignees:
NEC Corporation, Tokyo, JP;
Sanyo Chemical Industries, Ltd., Kyoto, JP;
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ;
U.S. Cl.
CPC ...
437228 ; 437229 ; 430311 ; 430314 ; 430317 ;
Abstract
A method for the geometry independent planarization of dielectric films on integrated circuits is disclosed. The method comprises forming the dielectric film, forming a polymer layer which polymer has the viscosity of 5,000 cps or less at 200.degree. C., reducing the viscosity of the polymer under baking to create a planar surface, hardening the polymer by the radiation or the electric beam and etching said polymer layer to transfer the planar surface to said dielectric film.