The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 18, 1990

Filed:

Apr. 06, 1990
Applicant:
Inventors:

Makoto Aoki, Yokohama, JP;

Yoshifumi Tahara, Yamato, JP;

Izumi Arai, Yokohama, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B44C / ; C23C / ; B05B / ; C03C / ;
U.S. Cl.
CPC ...
156345 ; 118 501 ; 118620 ; 118728 ; 156643 ; 20429831 ;
Abstract

A plasma processing device intended to plasma-process a wafer which is mounted on a mount in the plasma process vessel and clamped at the peripheral rim thereof between a clamping member and the mount. The wafer thus processed can be then handled when it is released from its clamped state. A plate spring is housed like a cantilever in a part of that portion of the clamping member which clamps the wafer relative to the mount, and a free end of the plate spring is projected from a recess which is formed on the underside of the clamping member to house the free end. When the wafer is clamped between the clamping member and the mount, the free end is housed in the recess, but when the wafer is released from its clamped state, the free end is projected from the recess to separate it from the clamping member. The wafer can therefore be left on the mount without adhering to the clamping member.


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