The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 02, 1990
Filed:
Jul. 17, 1989
Mitsubishi Denki Kabushiki Kaisha, Tokyo, JP;
Abstract
A probing plate for wafer testing is provided with a plurality of probes arranged so as to correspond to a plurality of bonding pads of semiconductor devices fabricated on a semiconductor wafer. The probing plate has a base plate formed of an insulating material, such as a photosensitive glass, and has contact fingers each having a raised portion in the free end thereof, contact conductors respectively formed on the surfaces of the raised portions of the contact fingers so as to be brought into contact with the corresponding bonding pads, and wiring conductors formed in a predetermined pattern on the surface of the base plate so as to extend respectively from the contact conductors. The contact conductors and the wiring conductors are formed simultaneously by a photolithographic process. The contact fingers and the raised portions thereof are also formed by subjecting the base plate to a photolithographic process. Forming the contact conductors over the surfaces of the raised portions of the contact fingers prevents accidental contact of the contact conductors with the bonding pads of semiconductor devices other than the objective semiconductor devices.