The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 11, 1990

Filed:

Apr. 07, 1988
Applicant:
Inventors:

Charles A Cockrum, Goleta, CA (US);

Jeffrey B Barton, Goleta, CA (US);

Eric F Schulte, Santa Barbara, CA (US);

Assignee:
Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ; H01L / ;
U.S. Cl.
CPC ...
437-5 ; 437-3 ; 437185 ; 437228 ; 437904 ; 437 22 ;
Abstract

An array of photodiodes is comprised of a Group II-VI material, such as HgCdTe, which is processed to form a plurality of diode junctions. The array is fabricated by a method which comprises a first step of providing a radiation absorbing base 12 of p-type Hg.sub.(1-x) Cd.sub.x Te material. Each of the photodiodes is fabricated by depositing a layer 18 of wider bandgap passivation material over the substrate, depositing a photomask layer 26 over the passivation layer and selectively removing the passivation layer through openings within the photomask layer. One method of removing the passivation layer 18 is by ion milling which also converts the underlying p-type substrate material to n-type material. The lattice damage caused by the ion milling extends laterally outward such that the n-type region 14, and associated p-n diode junction 16, is disposed beneath the passivation layer 18. Alternatively, the substrate material is converted to an opposite type of conductivity by depositing a layer of source material followed by a diffusion process.


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