The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 04, 1990
Filed:
Jan. 25, 1989
Applicant:
Inventors:
Assignees:
Showa Denko Kabushiki Kaisha, Tokyo, JP;
Chiyoda Kaushiki Kaisha, Osaka, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B24D / ; H01L / ;
U.S. Cl.
CPC ...
51296 ; 511314 ; 5128 / ; 51298 ; 51406 ; 51DI / ; 156636 ;
Abstract
A polishing pad for a semiconductor wafer, which pad is made of a foamed fluorine-contained resin sheet and is highly resistant to a corrosive polishing solution such as bromine-methanol system or bromine-methanol-silica powder system.
Takiyama, Masahiro. (1990). Polishing pad for semiconductor wafers (U.S. Patent No. 4954141). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/4954141
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile