The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 21, 1990

Filed:

May. 27, 1988
Applicant:
Inventors:

Kunihiro Tsubosaki, Hino, JP;

Gen Murakami, Machida, JP;

Toshiyuki Sakuta, Hamura, JP;

Masamichi Ishihara, Hinode, JP;

Satoru Ito, Tokyo, JP;

Yasuo Mori, Ohme, JP;

Assignee:

Hitachi, Ltd., Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L / ;
U.S. Cl.
CPC ...
357 72 ; 357 70 ;
Abstract

The present invention relates to a technique in which the pellet fixing parts of a lead frame of the tabless type or the type having no die pads are molded in or coated with a resin beforehand in order to enhance the reliability of a resin-encapsulated IC having become important with enlargement in the size of the chip of a memory IC or the like and reduction in the size of a resin package, and a resin package structure in which the technique of the lead frame having no die pads is applied to flat packaging so as to lessen reflow cracks.


Find Patent Forward Citations

Tsubosaki, Kunihiro. (1990). Resin-encapsulated semiconductor device (U.S. Patent No. 4951122). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/4951122

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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