The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 14, 1990
Filed:
Dec. 15, 1988
Akio Ohkoshi, Tokyo, JP;
Takuji Inoue, Tokyo, JP;
Eihachi Ogino, Joetsu, JP;
Tsutomu Nakazawa, Joetsu, JP;
Sony Corporation, Tokyo, JP;
Arisawa Mfg. Co., Ltd., Tokyo, JP;
Abstract
A method of producing a resin mold that includes the steps of pouring a first resin into a metal mold, curing the first resin at a first temperature thereby making an intermediate resin mold made of the first resin, separating the intermediate resin mold from the metal mold, pouring a second resin into the intermediate resin mold, curing the second resin at a second temperature thereby making a final resin mold made of the second resin and separating the final resin mold from the intermediate resin mold, wherein by selecting the first and second curing temperatures of the first and second resins, the final resin mold will have the same size as that of the metal mold.