The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 07, 1990
Filed:
Apr. 24, 1989
Mark L Dell'Eva, Schaumburg, IL (US);
Chieh-Yi J Yen, Rochester Hills, MI (US);
Jacob George, Mt. Clemens, MI (US);
General Motors Corporation, Detroit, MI (US);
Abstract
A laser optical profiler for determining the shape of a workpiece, the profiler in combination comprising means for projecting a laser probe line at a first fixed focal length on said workpiece at a first angle, means for providing relative movement between said probe line and said workpiece, imaging lens means for focusing on said workpiece at an angle nonspecular with respect to first angle at a second fixed focal length a receiver path to provide an image reflected off said workpiece, the reflected receiver path forming a line essentially coterminous with said probe line, the receiver path having a predetermined transverse width with alpha and beta portions, means to move said receiver path along with said probe line, a beam splitter means for dividing said receiver path into first and second portions, a first linear array of individual detectors associated with said first portion of said receiver path for detecting said alpha portion of said width of said receiver path and generating a signal in response thereto, a second linear array of individual detectors associated with said second part of said receiver path for detecting said beta portion of said width of said receiver path image and generating a signal in response thereto, and means for comparing said response of said first linear array with said response of said second linear array to determine the acceptability of said responses and means for detecting the linear location of the focal point of said probe line with respect to said workpiece whereby the profile of said workpiece is determined.