The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 03, 1990
Filed:
Oct. 11, 1988
Fujitsu Limited, Kanagawa, JP;
Abstract
After a semiconductor wafer is processed, a photoresist on the semiconductor wafer is removed by an irradiation of oxygen plasma while the wafer is cooled by a cooling device. The cooling device can be a susceptor or a stage on which the wafer is placed, and coolant flows through a pipe or duct installed thereto. Cooling of the wafer prevents the photoresist from being softened by the heat from the plasma. Thus, the inner side of the photoresist remains hard enough to support the affected surface portion of the photoresist, which is also difficult to remove, preventing the affected surface portion from sticking onto the surface of the wafer. Therefore, the affected portion can be more effectively irradiated by the plasma, and can be decomposed without leaving residue on the wafer. Reduced residue on the wafer surface contributes to improve production yield and quality of the products made from this wafer.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile