The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 03, 1990
Filed:
Dec. 22, 1988
Nobuto Yamazaki, Tachikawa, JP;
Minoru Kawagishi, Kokubunji, JP;
Kabushiki Kaisha Shinkawa, Tokyo, JP;
Abstract
A die bonding apparatus including a vertically moving block, a collet holder provided on the vertically moving block such that the collet holder itself freely moves up and down, a collet which holds a die to be bonded to a substrate and is installed in the collet holder, a first contact provided on the vertically moving block, and a second contact provided on the collet holder so that the second contact is pressed by a spring to make contact with the upper surface of the first contact. The position where rapid downward movement of the collet is stopped and the bonding load applied to the substrate are decided based upon a signal which is generated upon separation of the two contacts.