The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 27, 1990

Filed:

Jul. 18, 1988
Applicant:
Inventors:

Bangalore J Shanker, Santa Clara, CA (US);

Jagdish G Belani, Cupertino, CA (US);

Assignee:

National Semiconductor Corporation, Santa Clara, CA (US);

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ;
U.S. Cl.
CPC ...
357 82 ; 16510433 ;
Abstract

A CERDIP housing is provided with a heat pipe that passes through the closure seal lid whereby the heat pipe terminates within the housing cavity at the hot end thereof. A quantity of working fluid, such as fluorinated octane, is contained within the package cavity. The heat pipe communicates with cooling fins that produce a cold end thereof. Heat from the semiconductor device inside the housing boils the working fluid and is cooled thereby. The fluid vapor passes along the heat pipe and is condensed at the cold end to be converted back to liquid. As a result the semiconductor device is in direct communication with the heat pipe working fluid.


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Shanker, Bangalore. (1990). Use of a heat pipe integrated with the ic package for improving thermal (U.S. Patent No. 4912548). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/4912548

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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