Processing apparatus and method

Abstract

A process module which is compatible with a system using primarily vacuum wafer transport, but which permits processing multiple slices in parallel in a single module. This is accomplished by using notched quartz arms in the module, so that the transfer arm can place each of several wafers into one set of notches in the quartz arms. Optionally, a vertical degree of movement in the arm may be used to accomplish this, and the quartz arms may be immovable. This means that the port from the multi-wafer module into the wafer transfer system must be high enough to accommodate the necessary vertical movement of the transfer arm. After the transfer arm has placed the wafer on the quartz arms, the process module can be elevated to close around the set of wafers and made a seal. If the wafer transport arm is already configured to access wafers directly out of a multi-wafer vacuum wafer carrier, the necessary degree of freedom will necessarily already be present in the transfer arm, and at least one port of the necessary vertical dimensions will necessarily also be already present (between the loadlock and the transfer chamber). This is particularly useful in combination with relatively slow processes, such as thick field oxidation, long anneals, or long furnace heating steps used to drive in diffusions.