The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 20, 1990
Filed:
Feb. 23, 1988
Applicant:
Inventors:
Assignee:
Kabushiki Kaisha Toshiba, Kawasaki, JP;
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ;
U.S. Cl.
CPC ...
437228 ; 437 31 ; 437238 ; 437187 ; 357 34 ;
Abstract
In the invention, the width of the emitter contact layer is determined in accordance with the width of a first side wall, and the junction distance between a base contact layer and the emitter contact layer is determined in accordance with the width of a second side wall. The junction distance between the emitter contact layer and the base contact layer can be decreased, no extra high-temperature annealing such as thermal oxidation is needed, and the diffusion profile can be controlled to be shallow.
Motozima, Toshiyo. (1990). Method of manufacturing semiconductor device (U.S. Patent No. 4910170). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/4910170
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile