The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 20, 1990

Filed:

Jun. 05, 1989
Applicant:
Inventors:

Kazuo Yasaka, Kodaira, JP;

Yutaka Shinagawa, Iruma, JP;

Toru Miyamoto, Fuchuu, JP;

Assignees:

Hitachi, Ltd., Tokyo, JP;

Hitachi Microcomputer, Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ; H01L / ;
U.S. Cl.
CPC ...
437 52 ; 437 34 ; 437 40 ; 437 41 ; 437 48 ; 437 57 ; 437186 ; 437193 ; 437228 ;
Abstract

In a semiconductor integrated circuit device, such as a ROM having an instruction program set therein, in which an order for selecting word lines is variously different depending upon written information; a method of manufacture which can shorten a production process after the determination of the instruction program or the circuit arrangement of a decoder without adding to a manufacturing step is disclosed. Concretely, the method comprises the steps of providing selector switch elements which serve to select decode signal lines in accordance with address signals received from pairs of complementary address signal lines, each pair including a true line and a bar line, in a decoder forming region of a semiconductor substrate; providing a conductor film which is connected to input terminals of the selector switch elements and which is extended under regions for forming the true lines and the bar lines; providing an interlayer insulator film on the selector switch elements and the conductor film; forming contact holes in the interlayer insulator film on the conductor film so as to reach the conductor film; and connecting either of the true lines and the bar lines to the conductor film through the contact holes.


Find Patent Forward Citations

Loading…