The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 13, 1990
Filed:
Oct. 13, 1987
Applicant:
Inventors:
Masayuki Hata, Itami, JP;
Hiromasa Nakagawa, Itami, JP;
Assignee:
Mitsubishi Denki Kabushiki Kaisha, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L / ;
U.S. Cl.
CPC ...
357 68 ; 357 41 ;
Abstract
A semiconductor integrated circuit device includes a semiconductor substrate and a wiring layer formed on the substrate. An output buffer transistor is provided with its gate formed along the direction of the wiring. The resulting device has improved area efficiency and is less susceptible to wiring element slide without requiring slits to be formed in the wiring structure--and thus also has lower current density.
Hata, Masayuki. (1990). Semiconductor integrated circuit device with high reliability wiring (U.S. Patent No. 4908690). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/4908690
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile