The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 12, 1989

Filed:

Aug. 19, 1987
Applicant:
Inventors:

Hiroshi Watanabe, Mito, JP;

Osamu Miura, Hitachi, JP;

Kunio Miyazaki, Hitachi, JP;

Shunichi Numata, Hitachi, JP;

Kanji Otsuka, Higashiyamato, JP;

Assignee:

Hitachi, Ltd., Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ;
U.S. Cl.
CPC ...
156643 ; 1566591 ; 1566611 ; 156668 ; 437203 ; 437944 ;
Abstract

In a process for forming a wiring conductor of Cu, Al, Au or the like on a wiring substrate, polyimide-based resin having the following unit structural formula is used as a lift-off material. ##STR1## wherein R.sub.1 : ##STR2## R.sub.2 : ##STR3## n is an integer of 15,000 to 30,000. This lift-off material has very good etching susceptibility and can be selectively lifted off with an etching solution of a mixture of hydrazine and ethylene diamine from a lower polyimide layer having R.sub.1 : ##STR4## R.sub.2 : ##STR5## .


Find Patent Forward Citations

Watanabe, Hiroshi. (1989). Process for forming wiring on substrate (U.S. Patent No. 4886573). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/4886573

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…