The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 14, 1989
Filed:
Mar. 11, 1988
David W Boss, Beacon, NY (US);
Timothy W Carr, Hopewell Junction, NY (US);
Derry J Dubetsky, Wappingers Falls, NY (US);
George M Greenstein, Hopewell Junction, NY (US);
Warren D Grobman, Carmel, NY (US);
Carl P Hayunga, Poughkeepsie, NY (US);
Amanda H Kumar, Hopewell Junction, NY (US);
Walter F Lange, Longmont, CO (US);
Robert H Massey, Wappingers Falls, NY (US);
Paul H Palmateer, Wappingers Falls, NY (US);
John A Romano, Hopewell Junction, NY (US);
Da-Yuan Shih, Poughkeepsie, NY (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
Sealing and stress relief are provided to a low-fracture strength glass-ceramic substrate. Hermeticity is addressed through the use of capture pads in alignment with vias and through polymer overlays with interconnection between the underlying via or pad metallurgy and the device, chip, wire or pin bonded to the surface of the layer. Multilevel structures are taught along with a self-aligned sealing and wiring process.