The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 17, 1989
Filed:
Mar. 28, 1988
Applicant:
Inventor:
Ju-Don T Pan, Austin, TX (US);
Assignee:
Microelectronics and Computer Technology Corporation, Austin, TX (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C23C / ; H01L / ;
U.S. Cl.
CPC ...
20419211 ; 156643 ; 2041923 ; 20419234 ; 437228 ;
Abstract
A process for filling cavities in a flat surface on a substrate by metal deposition which includes depositing a film of metal onto the flat surface and cavities in a substantially perpendicular direction to the surface, and simultaneously re-sputtering and deposited film on the flat surface by ion beam milling at an angle to the surface of the substrate for achieving the deposition of metal into the cavities and filling the cavities without leaving any film on the flat surface.
Pan, Ju-Don. (1989). Method of deposition of metal into cavities on a substrate (U.S. Patent No. 4874493). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/4874493
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile