The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 17, 1989
Filed:
Aug. 26, 1988
Takashi Ogata, Toda, JP;
Masanori Kato, Tokyo, JP;
Yoshio Kawasumi, Toda, JP;
Chikara Tominaga, Tokyo, JP;
Kanji Tanaka, Ohita, JP;
Nippon Mining Co., Ltd., Tokyo, JP;
Abstract
A method is provided for producing high purity electrolytic copper useful, for example, to make a copper wire for use in sound or image reproducing systems, such as audio, video and television systems, etc. The copper wire consists of high purity copper in which silver and sulfur contents are both not more than 0.5 ppm and preferably has a crystal grain size not less than 0.02 mm and is unidirectionally solidified or is a single crystal. Such a copper wire is manufactured by continuously casting electrodeposited copper which has been obtained by refining by re-electrolysis of electrolytic copper, using a specially arranged casting apparatus having a mold projecting to an electrolytic bath.