The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 10, 1989

Filed:

Jun. 16, 1988
Applicant:
Inventors:

Donald F Foust, Scotia, NY (US);

Edward J Lamby, Scotia, NY (US);

Bradley R Karas, Amsterdam, NY (US);

William V Dumas, Delanson, NY (US);

Elihu C Jerabek, Glenmont, NY (US);

Assignee:

General Electric Company, Schenectady, NY (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
B32B / ; B32B / ; B44C / ; H05K / ;
U.S. Cl.
CPC ...
428209 ; 156656 ; 1566591 ; 156668 ; 156902 ; 204 30 ; 427 96 ; 427 98 ; 427304 ; 427307 ; 428458 ; 4284744 ; 428601 ; 428626 ; 428901 ;
Abstract

An improved method for pretreating a polyimide surface in preparation for an adhesion promotion treatment and subsequent metallization is disclosed, wherein the pretreatment comprises mild etching of the surface, contact of the surface with a basic solution, and contact of the surface with a cationic surfactant which is capable of removing a residual film formed on the surface after the mild etching step. This invention further includes articles such as printed circuit boards, which comprise a polyimide substrate pretreated as described above and then treated with an adhesion promoter, wherein an electrolessly-applied metal layer is disposed on the substrate, and an electrolytically-applied metal layer free of chemical additives is disposed on the electrolessly-applied layer. The article may include an additional electrolytically-applied layer containing chemical additives and disposed on top of the first electrolytic layer.


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Foust, Donald. (1989). Method for preparing polymer surfaces for subsequent plating thereon, (U.S. Patent No. 4873136). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/4873136

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