The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 26, 1989
Filed:
Mar. 16, 1989
Applicant:
Inventors:
Kenichi Kawai, Toyota, JP;
Nobuo Fukuma, Toyota, JP;
Akira Matsui, Toyota, JP;
Kenichiro Futamura, Toyota, JP;
Eizi Asada, Toyota, JP;
Tatsuhiko Fukuoka, Toyota, JP;
Assignees:
Toyota Motor Corporation, Toyota, JP;
Taiho Kogyo Co., Ltd., Aichi, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C22C / ; C22C / ; C22C / ; C22C / ;
U.S. Cl.
CPC ...
420559 ; 420566 ; 420571 ; 420587 ; 420589 ;
Abstract
Soldering material essentially consists of 20-50% of Pb, 0.5-less than 1% of Sb, 0.1-5% of In, and balance of Sn. Such material is suitable to solder electronic parts exposed to temperature variation and mechanical vibration.