Toyota, Japan

Kenichi Kawai


Average Co-Inventor Count = 6.0

ph-index = 1

Forward Citations = 2(Granted Patents)


Company Filing History:


Years Active: 1989

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1 patent (USPTO):Explore Patents

Title: Kenichi Kawai: Innovator in Soldering Materials

Introduction

Kenichi Kawai is a notable inventor based in Toyota, Japan. He is recognized for his contributions to soldering materials, particularly in the development of alloys that enhance the reliability of electronic components.

Latest Patents

Kawai holds a patent for a Pb-Sn-Sb-In solder alloy. This innovative soldering material consists of 20-50% lead (Pb), 0.5-1% antimony (Sb), 0.1-5% indium (In), with the balance being tin (Sn). This composition is specifically designed to solder electronic parts that are exposed to temperature variations and mechanical vibrations, making it highly suitable for various applications in the electronics industry.

Career Highlights

Throughout his career, Kenichi Kawai has worked with prominent companies, including Toyota Motor Corporation and Taiho Kogyo Co., Ltd. His experience in these organizations has allowed him to refine his expertise in materials science and engineering.

Collaborations

Kawai has collaborated with notable coworkers such as Nobuo Fukuma and Akira Matsui, contributing to advancements in the field of soldering materials.

Conclusion

Kenichi Kawai's innovative work in soldering materials has made a significant impact on the electronics industry. His patented solder alloy demonstrates his commitment to enhancing the performance and reliability of electronic components.

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