The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 12, 1989
Filed:
Jun. 13, 1988
Applicant:
Inventors:
Haruo Akahoshi, Hitachi, JP;
Kanji Murakami, Mito, JP;
Mineo Kawamoto, Hitachi, JP;
Akio Takokoro, Ibaraki, JP;
Ritsuji Toba, Hadano, JP;
Toyofusa Yoshimura, Ibaraki, JP;
Assignee:
Hitachi, Ltd., Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B05D / ;
U.S. Cl.
CPC ...
4274431 ; 118410 ; 118429 ; 118600 ;
Abstract
An electroless copper plating process for producing fine patterned wiring boards is improved by supplying very fine oxygen-containing gas bubbles through a porous alkali-resistant resin gas dispersing tube. An electroless copper plating apparatus having such a gas dispersing tube is also provided.