The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 12, 1989

Filed:

Aug. 01, 1988
Applicant:
Inventors:

Michael H McLaughlin, Scotia, NY (US);

Carl M Penney, Schenectady, NY (US);

Assignee:

General Electric Company, Schenectady, NY (US);

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B24B / ;
U.S. Cl.
CPC ...
5128 / ; 5116571 ; 5116572 ; 51326 ; 901 47 ; 901 41 ; 36447406 ; 364513 ;
Abstract

Automated grinding is performed using a tracking means having a sufficient field of view to locate edges to be processed and using a high resolution profiler in order to provide grinding information for calculation of the amount of material which should be removed from the workpiece. Those sections of the workpiece not requiring additional grinding may be traversed at a high speed in order to improve productivity. A process control computer receives grinding information from the tracking means and high resolution profiler and uses it to control a manipulator to adjust the travel speed of the grinder, force with which a grinder is applied, position of the grinder, and/or speed of rotation of the grinder in order to remove the correct amount of material from a workpiece. The technique is especially advantageous in removing excess material, burrs, nicks, chips and other minor irregularities in workpieces. A second profiler may be used to check that the grinder has properly ground portions of the workpiece. The tracking means and the profilers are flying spot laser profilers. The technique can accommodate either force-control or position-control grinding.


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