The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 06, 1989
Filed:
Dec. 03, 1987
Applicant:
Inventor:
Frederick J Beckett, Portland, OR (US);
Assignee:
Tektronix, Inc., Beaverton, OR (US);
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H05K / ;
U.S. Cl.
CPC ...
29846 ; 174 685 ; 361406 ;
Abstract
A contact bump is formed on a sheet of electrically-conductive material by plastically deforming the sheet so as to form a depression at one side of the sheet and a corresponding bump at the opposite side of the sheet. Solid material is placed in the depression, and the sheet of electrically-conductive material is secured at its one side to a support member.
Beckett, Frederick. (1989). Method of forming a contact bump (U.S. Patent No. 4835859). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/4835859
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile