The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 23, 1989

Filed:

Oct. 05, 1987
Applicant:
Inventors:

Toshio Tamamura, Tokyo, JP;

Akira Hoshika, Tokyo, JP;

Kiyoyasu Hiwada, Tokyo, JP;

Assignee:

Hewlett-Packard Company, Palo Alto, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01R / ;
U.S. Cl.
CPC ...
3241 / ; 324130 ;
Abstract

A method and an apparatus for measuring settling characteristics of a device under test. A measurement system for measuring an input signal by sampling and digitizing that input signal is employed to obtain reference data by measuring a reference signal, at least one level of which is flat, and to obtain measurement data by measuring a second signal representing the settling characteristics to be measured but containing an error component due to inclusion of the measurement system itself. The error component is removed from the measurement data by adjusting the timing and level of the reference data relative to those of the measurement data.


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