The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 28, 1989
Filed:
Aug. 12, 1987
Applicant:
Inventor:
Fumio Kuraishi, Nagano, JP;
Assignee:
Shinko Electric Industries Co., Ltd., Nagano, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ; H01L / ;
U.S. Cl.
CPC ...
357 70 ; 357 81 ;
Abstract
A plastic molded semiconductor device which includes a metal lead frame having a heat spreader extending from a stage on which a semiconductor chip is mounted. The heat spreader is located between a periphery of the stage and inner leads located opposite to the stage. The chip is electrically connected to the inner leads by an insulative film having a plurality of conductive patterns.
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Kuraishi, Fumio. (1989). Semiconductor device and lead frame used therefor (U.S. Patent No. 4809053). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/4809053
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile