High density connector design using anisotropically pressure-sensitive

Abstract

A high density connector in which the conductive leads of at least two circuit boards, two flexible circuits, or one of each are interconnected directly without the use of a traditional molded connector with pins captured therein. This is accomplished by overlapping the two boards with the conductive paths on each to be interconnected facing each other. An anisotropic elastomeric polymer material is inserted between the boards and then the sandwich is clamped together compressing the polymer material to provide a low electrical resistance path therethrough to interconnect the conductive paths on the respective circuit boards. One disclosed embodiment utilizes backing plates above and below the sandwich with a plurality of screws passing through registration holes to align the conductive paths and to provide closure of the connector. The other disclosed embodiment is designed to interconnect two boards along substantially the full width of the boards. This is accomplished with clamping bars that have thumb screws at either end and at selected spacings along the length of the clamping bars to ensure closure between the two boards. The thumb screws here also pass through registration holes in the sandwich to align the conductive paths. Further, bosses are included around each of the thumb screw holes in the clamping bars to align the boards.