The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 21, 1989

Filed:

Oct. 23, 1986
Applicant:
Inventors:

Hirokazu Yoshida, Osaka, JP;

Hiroshi Nakatani, Tenri, JP;

Keiji Yamamura, Sakurai, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ;
U.S. Cl.
CPC ...
437206 ; 2940208 ; 29847 ; 29835 ; 29853 ; 29762 ; 437180 ; 437008 ; 437923 ; 357 80 ;
Abstract

A method for the replacement of semiconductor devices in a multi-chip module that is constructed by mounting semiconductor devices on a tape carrier used as an electrical wiring substrate, wherein when at least one of said semiconductor devices develops a flaw, it is cut away at the finger sections that connect said defective semiconductor device to the tape, and then a different and non-defective semiconductor device having finger sections longer than those of said defective semiconductor device that has been removed is connected to said tape in such a manner that the finger sections of said different and non-defective semiconductor device are joined and connected to the corresponding finger sections retained on said tape.


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