The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 25, 1988
Filed:
May. 06, 1987
Applicant:
Inventors:
Yasuaki Ohtani, Saitama, JP;
Fusao Birukawa, Saitama, JP;
Assignee:
Nippon CMK Corporation, Saitama, JP;
Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K / ;
U.S. Cl.
CPC ...
29846 ; 179 685 ; 427 96 ;
Abstract
A method of producing printed circuit boards comprises the steps of applying a first solder resist on the conductor circuit pattern so as to surround lands to be soldered in the pattern and then applying a second solder resist to the whole surface of the pattern so as to leave portions having a size larger than the size of the land and smaller than the outer diameter of the first solder resist.
Ohtani, Yasuaki. (1988). Method of producing printed circuit boards (U.S. Patent No. 4779339). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/4779339
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile