The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 04, 1988
Filed:
Oct. 02, 1986
Applicant:
Inventors:
Assignee:
Mitsubishi Denki Kabushiki Kaisha, Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B26F / ;
U.S. Cl.
CPC ...
225105 ; 225 93 ; 225103 ;
Abstract
A semi-full cut semiconductor wafer is put on an adhesive sheet attached to a ring frame. Then, the semiconductor wafer is pushed upward from the back surface of the adhesive sheet by a rotatable breaking member in the shape of a disk the edge portion of which is triangular in section. In this state, the ring frame is moved so that the breaking member may not deviate from dicing lines, whereby the semiconductor wafer is divided into a large number of chips.