The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 13, 1988
Filed:
Mar. 16, 1987
Markus Seibel, Mainz, DE;
Hoechst Aktiengesellschaft, Frankfurt am Main, DE;
Abstract
A process for the manufacture of through-hole plated electric printed-circuit boards is described, in which a board of an insulating material is provided with plated-through holes which are arranged in a grid pattern and the walls of which are coated with a conductive metal layer. The board is covered with a conductive metal layer on at least one side thereof. After metallizing the holes, the metal layer is covered imagewise and the areas of the metal layer which are not covered are either reinforced by metal deposition or removed by etching. Together with the metal layer, part of the holes are covered in such a way that only the required portion of all holes act as conductive connections in the final product. The process of the present invention permits the large-scale manufacture of a predrilled or prepunched and premetallized base material for printed circuits.