The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 06, 1988
Filed:
Apr. 10, 1986
Constantine A Neugebauer, Schenectady, NY (US);
Richard O Carlson, Scotia, NY (US);
General Electric Company, Schenectady, NY (US);
Abstract
Solder layers in a semiconductor chip package, which electrically interconnect conductors used to gain electrical access to the electrodes on the semiconductor chip, are subjected to a transverse compressive force in excess of about 2 pounds per square inch. The semiconductor chip package can thereby undergo a marked increase in the number of cycles of heating and cooling before it fails due to increased thermal resistance arising from structural degradation of the solder layers.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile