The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 17, 1988

Filed:

Feb. 19, 1986
Applicant:
Inventors:

Yosuke Inoue, Ibaraki, JP;

Takaya Suzuki, Katsuta, JP;

Masahiro Okamura, Tokyo, JP;

Noboru Akiyama, Hitachi, JP;

Masato Fujita, Yamanashi, JP;

Hiroo Tochikubo, Tokyo, JP;

Shinya Iida, Tama, JP;

Assignees:

Hitachi, Ltd., Tokyo, JP;

Kokusai Elect. Co. Ltd., Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C23C / ; C23C / ;
U.S. Cl.
CPC ...
437102 ; 437173 ; 437225 ; 437235 ; 437101 ; 148D / ; 148D / ; 156611 ; 156613 ; 427 51 ; 4272481 ; 118724 ; 118730 ;
Abstract

The vapor phase growth on semiconductor wafers is carried out by an apparatus in which a multiplicity of semiconductor wafers are held by a holder so that the semiconductor wafers lie one over another in a vertical direction, and are rotated together with the holder, the holder is placed in a heater disposed in a reaction vessel, a raw material gas supply nozzle and a raw material gas exhaust nozzle are provided within the heater so that the semiconductor wafers are interposed between the gas supply nozzle and the gas discharge nozzle, and the gas supply nozzle and the gas discharge nozzle have gas supply holes and gas discharge holes, respectively, so that a raw material gas can flow on each semiconductor wafer in horizontal directions. When the temperature of the heater is raised by a heating source to heat the semiconductor wafers, the raw material gas is supplied from the gas supply holes to each semiconductor wafer, and thus a uniform layer is grown on each semiconductor wafer from the raw material gas.


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