The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 10, 1988
Filed:
Dec. 15, 1986
Michael A Olla, Denton, TX (US);
Linn C Garrison, Dallas, TX (US);
Robert H Bond, Denton, TX (US);
Harold Trammell, Tarrant, TX (US);
Thomson Components-Moster Corporation, Carrollton, TX (US);
Abstract
A method of forming leadframes for use in manufacturing semiconductor chips starts with fabricating a plurality of leadframes by metal stamping or etching leadframe patterns into a flat ribbon of conductive material. The leadframe patterns include a plurality of outwardly radiating leads, inner radiating leads, and a central perimeter for interconnecting the outwardly and inner radiating leads. The outwardly radiating leads are arranged in groups, each of which are directed along planar perpedicular coordinates. The inner radiating leads have 180 degrees turns in the plane of the leadframe. The inner radiating leads are then successively bent at an acute angle and parallel to the plane of said leadframe so that the inner radiating leads are offset from the plane of the leadframe. The bending is performed in such a manner that each of the leads are formed with a stable spring force for effective bonding to corresponding semiconductor chip pads.