The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 26, 1988
Filed:
Feb. 02, 1987
Applicant:
Inventors:
Eietsu Hasegawa, Satte, JP;
Rikiya Kato, Souka, JP;
Assignee:
Senju Metal Industry Co., Ltd., Tokyo, JP;
Primary Examiner:
Int. Cl.
CPC ...
B23K / ; B22F / ;
U.S. Cl.
CPC ...
148 24 ; 75255 ;
Abstract
A solder paste comprises a solder paste portion containing powdered solder and metallic spheres which are made of a material having a higher melting point than the solder paste portion and whose surface can be wet by molten solder. The metallic spheres have a diameter of 0.07-0.3 mm. The metallic spheres can comprise a single metal or two metals, one of which forms the center of the sphere and the second of which is plated on the surface of the first.
Hasegawa, Eietsu. (1988). Solder paste for electronic parts (U.S. Patent No. 4740252). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/4740252
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile