The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 05, 1988

Filed:

Jun. 22, 1987
Applicant:
Inventors:

Yoshio Fujiwara, Tochigi, JP;

Naotake Kobayashi, Tochigi, JP;

Yuichi Matsubara, Tochigi, JP;

Hisashi Ando, Tochigi, JP;

Hidehiro Numao, Tochigi, JP;

Kazuaki Suzuki, Tochigi, JP;

Assignee:

Sony Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B / ; B32B / ;
U.S. Cl.
CPC ...
428209 ; 428356 ; 428328 ; 428901 ;
Abstract

An electrically conductive adhesive sheet is disclosed which has an electrically conducting property across a thickness thereof and an electrically insulating property along a sheet surface direction. The electrically conductive adhesive sheet comprises an electrically insulating adhesive material and electrically conductive metal powder uniformly dispersed therein. The metal powder has a melting point lower than a certain working temperature, and is flattened by application of pressure between a pair of conductors between which the adhesive sheet is provided. The adhesive material is molten at the certain working temperature and is flown by application of pressure. The adhesive sheet is useful to electrically connect a pair of circuit boards each having a plurality of conductor patterns thereon by bonding corresponding ones through the metal powder as molten, while keeping the neighboring patterns insulated. The circuit board is mechanically integrated simultaneously by the adhesive sheet. The circuit board and the connection structure using such an adhesive sheet as above are also disclosed.


Find Patent Forward Citations

Loading…