The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 12, 1988

Filed:

Sep. 06, 1985
Applicant:
Inventors:

Claudio Contiero, Buccinasco, IT;

Giulio Iannuzzi, Vimercate, IT;

Giorgio De Santi, Milan, IT;

Fabrizio Andreani, Parma, IT;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ; H01L / ; C23F / ;
U.S. Cl.
CPC ...
156652 ; 156656 ; 1566591 ; 1566611 ; 156665 ; 430318 ; 437228 ;
Abstract

Structure and method for metallization patterns of different thicknesses on a semiconductor device or integrated circuit. The improved structure and method utilizes three layers of metal in order to reduce the required number of processing steps. One preferred embodiment entails a single metal deposition sequence followed by two etch steps, while a second embodiment, suitable for thicker metallization, requires only two depositions and two etch steps.


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