The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 11, 1987
Filed:
Mar. 04, 1985
Applicant:
Inventors:
H Erwin Grellmann, Beaverton, OR (US);
Leonard A Roland, Portland, OR (US);
Assignee:
Tektronix, Inc., Beaverton, OR (US);
Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01P / ;
U.S. Cl.
CPC ...
333 33 ; 333246 ; 333260 ; 361404 ; 174 685 ; 29829 ; 29850 ;
Abstract
A bond wire connection between two semiconductor devices alleviates the problem of inductive loading at high frequencies by providing a capacitive effect which compensates for inductive reactance. The capacitive effect is provided by utilizing multiple parallel layers of bond wires at a common electrical connection point. As more layers are added the net impedance can be controlled so as to match the impedance driving the downstream semiconductor.