The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 16, 1987

Filed:

Sep. 25, 1986
Applicant:
Inventors:

Eiji Setoyama, Hitachi, JP;

Keiji Arimatsu, Hitachi, JP;

Youichi Ohshita, Hitachi, JP;

Assignee:

Hitachi, Ltd., Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C23C / ;
U.S. Cl.
CPC ...
204298 ; 2041922 ;
Abstract

A sputtering apparatus for sputtering magnetic materials. The apparatus comprises at least one pair of magnetic field-generating sources, a substrate disposed within the magnetic field-generating sources, a target disposed opposite to the substrate, and a magnetic thin plate disposed at a side of the substrate which is remote from the target. The magnetic thin plate is disposed at a position in close contact with the substrate or a position slightly away from the substrate, or is disposed movably between such positions. When sputtering a magnetic material onto the substrate, a uniform magnetic field can be generated on the substrate surface by virtue of the provision of the thin magnetic plate.


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