The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 09, 1987

Filed:

Sep. 25, 1986
Applicant:
Inventors:

Masami Yamaoka, Anjo, JP;

Yukio Tsuzuki, Aichi, JP;

Shoji Toyoshima, Konan, JP;

Assignee:

Nippondenso Co., Ltd., Kariya, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ;
U.S. Cl.
CPC ...
357 13 ; 357 46 ; 357 34 ; 357 35 ; 357 51 ;
Abstract

In a semiconductor circuit device having a diode as an overvoltage protection element, a semiconductor substrate is comprised of an N-type collector substrate integral with a transistor. An N.sup.+ type collector diffusion layer is formed on the rear surface of the substrate. A P-type anode region and a N.sup.+ cathode region are formed in the major surface of the substrate so that they are spaced apart from each other and the N.sup.+ cathode region has the same type of impurity, but at a higher impurity concentration level than, the semiconductor substrate. An insulating film is formed on the surface of the resultant structure. A gate electrode is formed in an overlapping relation to the anode region and cathode region with an insulating film therebetween. A gate potential is established between the gate electrode and the underlying substrate.


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