The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
May. 05, 1987

Filed:

Jul. 26, 1985
Applicant:
Inventors:

Hideki Yasuoka, Takasaki, JP;

Yasunobu Tanizaki, Takasaki, JP;

Akira Muramatsu, Takasaki, JP;

Norio Anzai, Tokorozawa, JP;

Assignee:

Hitachi, Ltd., Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L / ;
U.S. Cl.
CPC ...
29571 ; 2957 / ; 2957 / ; 2957 / ; 148175 ; 148187 ;
Abstract

The present invention relates to a Bi-CMOS.IC, characterized by comprising a semiconductor substrate of a first conductivity type, and a semiconductor layer of a second conductivity type which is epitaxially grown on one major surface of said semiconductor substrate and which is electrically isolated into a plurality of semiconductor island regions by a thick surface oxide film formed by local oxidation and a semiconductor diffused layer of the first conductivity type formed between said oxide film and said substrate; a bipolar type semiconductor element being formed in one of said island regions, while CMOS type semiconductor elements are formed in the other island regions; the thick surface oxide film formed by the local oxidation being included between a base region and a collector contact region within said one island region formed with said bipolar type semiconductor element, while gate electrodes made of a semiconductor are disposed over said other island regions formed with said CMOS type semiconductor elements.


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