Mounting an integrated circuit chip to an etched circuit board

Abstract

An integrated circuit chip is mounted to an etched circuit board using a flexible, sheet-form interconnect member that comprises dielectric material and runs of electrically conductive material each run extending between a contact pad that is exposed at a first main face of the interconnect member and a termination point that is exposed at a second main face of the interconnect member. The interconnect face of the chip and the second main face of the interconnect member are placed in mutually confronting relationship, and the chip is attached to the second main face of the interconnect member by way of its interconnect face, whereby electrically conductive contact is established between the contact pads of the chip and corresponding termination points of the interconnect member. The chip is attached by way of its back face to a thermally conductive plate that has, at one main face, pressure pads that at least partially surround a chip receiving area of the plate. The first main face of the interconnect member and the main face of the circuit board are placed in mutually confronting relationship, with the contact pads of the interconnect member in registration with corresponding contact pads of the circuit board. The plate and the circuit board are clamped together, whereby the pressure pads supply contact force to maintain the contact pads of the interconnect member in electrically conductive pressure contact with the corresponding contact pads of the circuit board.